Printing for faster electronics
Friday, December 7th, 2012 by Roberto SaraccoResearchers at the University of Pennsylvania have found a way to use nano-particles of cadmium selenide to print electronic circuits on a plastic substrata.
Flexible circuits are very interesting since they can be used in a variety of applications and several solutions have been found.
They all share the characteristics of being possible through a process of deposition at ambient temperature (or not too different from that) since the plastic substrate used would melt at high temperature, like the ones used to create a silicon wafer.
The interest in the discovery of this group of researchers at Penn is that the resulting circuits have a performance 20 times better than an equivalent circuit based on silicon.
Now, we don’t need to be overexcited. The silicon production has achieved a tremendous degree of effectiveness, quality and performance and it will take several years to have an alternative production method.
Having said that, however, we can see that for a number of applications there is the need for a flexible chip and as these applications will become reality we will see this technology grow in volume and hence become more effective in terms of production processes. This is all what it takes to start a positive innovation spiral that eventually may lead to the dismissal of silicon. This latter, however, is not on the horizon!







